High Performance — Extremely SoftThe silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.Safe ApplicationElectrically insulating. non-adhesive. and easy to handle — for safe and reliable heat transfer.Minimizing Thermal ResistanceThe thinner the pad. the lower the thermal resistance. Depending on mounting pressure. the TP-4 can be compressed to up to 60% of its original thickness.Bridging Uneven SurfacesAdapts optimally to varying chip heights. air gaps. and uneven surfaces to ensure reliable contact.Available in Various Thicknesses and SizesAvailable in 0.5 mm.
1.0 mm. and 1.5 mm thicknesses as well as multiple sizes. GPUs. consoles. laptops. and many other electronic components. Flexible. vibration-dampening. and easy to cut.

